Honor Moment | Maxic’s dToF Sensor Wins 2025 China Innovative IC – Excellent Core Award

  • Release Date2025-07-17

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On July 11–12, the 5th China IC Design Innovation Conference and Application Exhibition of IC (ICDIA2025), co-hosted by the China IC Design Innovation Alliance and the National Xinhuo Platform for Innovation and Entrepreneurship, was held at the Suzhou Jinji Lake International Convention Centre.

Maxic’s fully integrated direct time-of-flight (dToF) sensor won the prestigious 2025 China Innovative IC – Excellent Core Award.

With the theme “Independent Innovation, Application Landing, and Ecological Co-construction,” the conference focused on AI computing power and data processing, photonic integrated circuits, AIoT and edge computing, intelligent vehicles, and autonomous driving. It aims to share cutting-edge technological breakthroughs and their applications, foster the transformation of innovative achievements and cross-industry partnerships, and build a collaborative platform for chip development, application solutions, and end-product innovation.



On July 11, during the welcome banquet, the China IC Design Innovation Alliance held the prestigious “2025 China Innovative IC – Chip Power Award” ceremony. Five major awards were presented: Emerging Star Award, Innovative Application Award, Excellent Core Award, Leading Core Award, and Ecosystem Contribution Award.


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Maxic Wins the 2025 China Innovative IC – Excellent Core Award

Maxic has been recognized for its independently developed, fully integrated dToF sensor. The award acknowledges high-performance, competitive, and reliable IC products developed in China, helping end-product manufacturers and enterprise users in product selection and promoting the growth of domestic chip adoption and ecosystem building.

This honor highlights Maxic’s strong innovation capabilities in IC design, recognizes the company's achievements and core technologies in smart sensor development, and encourages continuous breakthroughs in optical sensing field.

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Award-Winning Product: Fully Integrated dToF Sensor

Maxic’s dToF sensor is based on single-photon time-of-flight ranging technology and supports a range of up to 5 meters. It integrates:


·   SPAD (Single-Photon Avalanche Diode)

·   On-chip algorithm processing module

·   Cortex-M0 core

·   940nm VCSEL and optical filter

The sensor is suitable for a wide range of applications, including smartphones, tablets, robotic vacuum cleaners, hair dryers, faucets, smart toilets, projectors, and drones.

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Key Features
  • Integrates light source, optical filter, and receiver-processing chip, available in OLGA12 package

  • Built-in Cortex-M0, supports algorithm development and programming for dedicated applications

  • Provides accurate time-of-flight measurements from 0.02m to 5.00m with less than 4% error

  • Integrated temperature sensor for real-time compensation and accuracy as temperature varies

  • I/O voltage supports 3.3V/1.8V/1.2V, ensuring compatibility with multiple platforms

  • Excellent EMI resistance characteristics and sunlight resistance

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Maxic’s dToF chips offer high-quality spatial sensing function, supporting fast ranging and obstacle avoidance. The company continues to expand its ToF product portfolio for applications in autonomous driving, drones, industrial measurement, robotics, and 3D scanning. With its strengths in LiDAR technology, Maxic is actively exploring new markets and remains committed in delivering comprehensive optical sensors and turn-key solutions to customers.